Cypress CYIL2SM1300AA-GZDC

Mounting Type

18-gauge Insulated Wires

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Mounting Feature

a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

THROUGH HOLE MOUNT

Manufacturer

BARKER MICROFARADS INC

Package Shape/Style

RECTANGULAR

Supply Voltage-Min

2.375 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

CYIL2SM1300AA-GZDC

Horizontal Pixel

1280

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ON SEMICONDUCTOR

Supply Voltage-Max

2.625 V

Risk Rank

5.3

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Case Code - 1

Size / Dimension

1.437in W

Tolerance

-0%/+20%

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

SNAPSHOT SHUTTER

Capacitance

36uF

Reach Compliance Code

compliant

Body Length or Diameter

35.5 mm

Body Breadth

30.5 mm

Output Type

DIGITAL VOLTAGE

Voltage

110V

Termination Type

SOLDER

Sensors/Transducers Type

IMAGE SENSOR,CMOS

Housing

CERAMIC

Output Interface Type

3-WIRE INTERFACE

Pixel Size

the horizontal and vertical measurements of an image expressed in pixels.

14X14 µm

Dynamic Range

90 dB

Optical Format

1 inch

Master Clock

315 MHz

Frame Rate

500 fps

Vertical Pixel

1024

Array Type

FULL FRAME

Sensitivity (V/lx.s)

10.16 V/lx.s

Height Seated (Max)

2.750in

Body Height

3.75 mm