Darfon C1005NP0689CGTS

Package / Case

0402

Number of Terminals

2

Factory Pack QuantityFactory Pack Quantity

1

Part # Aliases

154836-000

Manufacturer

TE Connectivity

Brand

TE Connectivity / Raychem

RoHS

N

Product Depth (mm)

0.5(mm)

Wire Form

Not Required

Operating Temp Range

-55C to 125C

Case Style

Ceramic Chip

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Surface Mount

Temp Coeff (Dielectric)

C0G

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

0.25pF

Rad Hardened

No

Microwave Application

NO

Seated Plane Height

Not Required(mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

6.8PF(pF)

Subcategory

Circular Connectors

Technology

STANDARD

Construction

SMT Chip

Termination Style

PAD

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

50VDC

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Circular MIL Spec Strain Reliefs & Adapters

Product Category

a particular group of related products.

Circular MIL Spec Strain Reliefs & Adapters

Product Length (mm)

1(mm)

Product Height (mm)

0.5(mm)