Darfon Elec C0603X7R222KGTS

Package / Case

0201

Number of Terminals

2

Tolerance (+ or -)

10%

Temp Coeff (Dielectric)

X7R

Mounting Styles

Surface Mount

Operating Temp Range

-55C to 125C

Rad Hardened

No

Case Style

Ceramic Chip

Product Diameter (mm)

Not Required(mm)

Wire Form

Not Required

Lead Diameter (nom)

Not Required(mm)

Microwave Application

NO

Product Depth (mm)

0.3(mm)

Seated Plane Height

Not Required(mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

2200PF(pF)

Construction

SMT Chip

Termination Style

PAD

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

50VDC

Product Length (mm)

0.6(mm)

Product Height (mm)

0.3(mm)