Darfon Elec C1608X5R106KDTS

Package / Case

0603

Number of Terminals

2

Case Style

Ceramic Chip

Mounting Styles

Surface Mount

Product Diameter (mm)

Not Required(mm)

Lead Diameter (nom)

Not Required(mm)

Temp Coeff (Dielectric)

X5R

Product Depth (mm)

0.8(mm)

Rad Hardened

No

Tolerance (+ or -)

10%

Microwave Application

NO

Operating Temp Range

-55C to 85C

Wire Form

Not Required

Seated Plane Height

Not Required(mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

10000000PF(pF)

Construction

SMT Chip

Termination Style

PAD

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

10VDC

Product Length (mm)

1.6(mm)

Product Height (mm)

0.8(mm)