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Dialog DA14530-XX000FX2
Part No:
DA14530-XX000FX2
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
66055598-DA14530-XX000FX2
Category:
Description:
RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
Products specifications
- Factory Pack QuantityFactory Pack Quantity4000
- ManufacturerDialog Semiconductor
- BrandDialog Semiconductor
- RoHSDetails
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Reel - SubcategoryWireless & RF Integrated Circuits
- TechnologySi
- Product Type
a group of products which fulfill a similar need for a market segment or market as a whole.
RF System on a Chip - SoC - Product Category
a particular group of related products.
RF System on a Chip - SoC
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