Dialog Semiconductor AT25DN512C-XMHF-B

Package / Case

TSSOP-8

RoHS

Details

Mounting Styles

SMD/SMT

Supply Voltage-Min

2.3 V

Active Read Current - Max

18 mA

Interface Type

SPI

Maximum Clock Frequency

104 MHz

Timing Type

Synchronous

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 85 C

Memory Types

NOR

Factory Pack QuantityFactory Pack Quantity

100

Unit Weight

0.001129 oz

Supply Voltage-Max

3.6 V

Series

AT25DN512C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

512 kbit

Speed

104 MHz

Supply Current-Max

12 mA

Architecture

Page Erase

Data Bus Width

8 bit

Organization

64 k x 8