ebm-papst Inc. PG1W-12-60-L3BN

Factory Lead Time

20 Weeks

Package / Case

Module

Material

Plastic

Shape

Round

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Fansink

Color

Black

Voltage - Rated DC

12V

Bearing Type

there are several different types of bearings, including ball and roller bearings, linear bearings, as well as mounted versions that may use either rolling element bearings or plain bearings.

Ball

Natural Thermal Resistance

0.94 °C/W

Diameter

72.009mm

Height

60.25mm

Length

84mm

Width

70mm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant