Elantec Semiconductor Inc EL2252CM

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Material

synthetic polyolefin

Number of Terminals

20

Diameter before shrinkage

70 mm

Part Life Cycle Code

Active

Neg Supply Voltage Limit-Max

-18 V

Operating Temperature-Max

75 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Equivalence Code

SOP20,.4

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Response Time-Nom

0.009 ns

Supply Voltage-Nom (Vsup)

15 V

Diameter of protected wire (cable)

40…65 mm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

in bundles of 1 m lengths

JESD-609 Code

e0

Type

Heat shrink tubing without adhesive

Terminal Finish

Tin/Lead (Sn/Pb)

Color

red

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Number of Functions

2

Terminal Pitch

The center distance from one pole to the next.

1.27 mm

Reach Compliance Code

unknown

JESD-30 Code

R-PDSO-G20

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Output Type

TOTEM POLE

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL EXTENDED

Supply Current-Max

20 mA

Amplifier Type

COMPARATOR

Neg Supply Voltage-Nom (Vsup)

-15 V

Average Bias Current-Max (IIB)

17 μA

Supply Voltage Limit-Max

18 V

Bias Current-Max (IIB) @25C

12 μA

Input Offset Voltage-Max

13000 μV