EPCOS (TDK) B32683A1103J

Package / Case

Not Required

ECCN (US)

EAR99

HTS

8532.25.00.20

Capacitance Value

0.01uF

Mounting

Through Hole

Terminal Pitch (mm)

22.5

Wire Form

Straight

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

110

Product Depth (mm)

7(Max)

Lead Diameter (mm)

0.8

Lead Length (mm)

6

Seated Plane Height (mm)

16(Max)

Operating Temp Range

-55C to 110C

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Through Hole

Temp Coeff (Dielectric)

PP

Lead Diameter (nom)

0.8(mm)

Tolerance (+ or -)

5%

Seated Plane Height

16(mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

5%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Pulse

Capacitance

10000(pF)

Construction

Wound

Termination Style

Radial

Dielectric

PP

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

1600VDC|500VAC

Size(mm)

26.5 X 7 X 16

Product Length (mm)

26.5(Max)

Product Height (mm)

16(Max)

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant