EPCOS (TDK) YNA15A3A0G105M

Package / Case

0805

Number of Terminals

2

EU RoHS

Compliant

ECCN (US)

EAR99

Capacitance Value

0.001uF

Microwave Application

No

Mounting

Surface Mount

Case Style

Ceramic Chip

Dissipation Factor (%)

3

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Product Depth (mm)

1.25

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Tolerance

10%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Construction

Flat

Termination Style

Pad

Dielectric

X7R

Voltage

250VDC

Size(mm)

2 X 1.25 X 0.85

Product Length (mm)

2

Product Height (mm)

0.85