Epson Electronics America Inc-Semiconductor Div S1V30120F01A100-160

Factory Lead Time

20 Weeks

Mounting Type

Surface Mount

Package / Case

64-TQFP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Not For New Designs

Applications

Signal Mixing

Function

Voice Processing Unit (VPU)

Number of Channels

1

Interface

SPI