Essentra Components 494626

Housing Material

Aluminium

Weight

28 g

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

1 %

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

20 ppm/°C

Resistance

825 Ω

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

250 °C

Min Operating Temperature

-55 °C

Composition

Wirewound

Power Rating

30 W

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

30 W

Military Standard

MIL-PRF-39009

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

0.01 %

Lead/Base Style

Solder

Features

Military, Moisture Resistant

Width

28.956 mm

Height

15.875 mm

Length

49.9872 mm

Lead Free

Contains Lead