EM6HE16EWAKG-12H

Etron Technology EM6HE16EWAKG-12H

Part No:

EM6HE16EWAKG-12H

Manufacturer:

Etron Technology

Datasheet:

-

Package:

-

AINNX NO:

32526334-EM6HE16EWAKG-12H

Description:

DRAM Chip DDR3L SDRAM 4Gbit 256M X 16 1.35V 96-Pin FBGA (Alt: EM6HE16EWAKG-12H)

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    96
  • Manufacturer Part Number
    EM6HE16EWAKG-12H
  • Rohs Code
    Yes
  • Part Life Cycle Code
    Contact Manufacturer
  • Ihs Manufacturer
    ETRON TECHNOLOGY INC
  • Package Description
    TFBGA,
  • Risk Rank
    5.72
  • Number of Words
    268435456 words
  • Number of Words Code
    256000000
  • Operating Temperature-Max
    85 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    TFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH
  • Supply Voltage-Nom (Vsup)
    1.35 V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    AUTO/SELF REFRESH
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8 mm
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    R-PBGA-B96
  • Supply Voltage-Max (Vsup)
    1.45 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Supply Voltage-Min (Vsup)
    1.283 V
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Organization
    256MX16
  • Seated Height-Max
    1.2 mm
  • Memory Width
    16
  • Memory Density
    4294967296 bit
  • Memory IC Type
    DDR DRAM
  • Access Mode

    Distinct operation recognized by the protection mechanisms as a possible operation on an object.

    MULTI BANK PAGE BURST
  • Self Refresh
    YES
  • Length
    13.5 mm
  • Width
    7.5 mm
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