Exar Corporation XRD9818ACGTR-F

Package / Case

TSSOP

Power Dissipation (Max)

325mW

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Number of Channels

3

Number of Bits

16

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant