Fox Electronics FO3HSCBM37.4-T2

Package / Case

Not Required

Lead Spacing (nom)

10(mm)

Product Depth (mm)

4.1(mm)

Operating Temp Range

-55C to 105C

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Through Hole

Temp Coeff (Dielectric)

PET

Lead Diameter (nom)

0.6(mm)

Tolerance (+ or -)

10%

Rad Hardened

No

Seated Plane Height

13.2(mm)

Package

Tape & Reel (TR)

Mfr

Fox Electronics

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

*

Capacitance

4700(pF)

Construction

WOUND

Termination Style

Radial

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

400VDC/220VAC

Size(mm)

12.5 X 4.1 X 13.2

Product Length (mm)

12.5(mm)

Product Height (mm)

13.2(mm)