Fox Electronics FO5HSKBM26.0-T1

Package / Case

Not Required

Lead Spacing (nom)

5(mm)

Product Depth (mm)

4.5(mm)

Operating Temp Range

-55C to 100C

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Through Hole

Temp Coeff (Dielectric)

PP

Lead Diameter (nom)

0.5(mm)

Tolerance (+ or -)

5%

Rad Hardened

No

Seated Plane Height

6(mm)

Package

Tape & Reel (TR)

Mfr

Fox Electronics

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

*

Type

Pulse

Capacitance

220(pF)

Construction

Radial

Termination Style

Radial

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

63VDC/40VAC

Size(mm)

7.2 X 4.5 X 6

Product Length (mm)

7.2(mm)

Product Height (mm)

6(mm)