Fraenkische USA, LP COPA-H-36G

Factory Lead Time

4 Weeks

Mounting Type

Fastener

Material

Polyamide (PA66), Nylon 6/6

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Fiplock®

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Clip, C-Type

Color

Gray

Type Attributes

Hinged, Locking

Opening Size

1.417 36.00mm

Panel Hole Size

0.236 5.99mm

Height

2.205 56.00mm

Length

2.165 55.00mm

Width

2.362 60.00mm

Material Flammability Rating

UL94 V-0

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant