Freescale Semiconductor, Inc. (NXP Semiconductors) 74LVCH16374ADGG:51

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Logic Family

LVC

Number of Channels per Chip

16

Number of Elements per Chip

2

Number of Element Inputs

8

Number of Element Outputs

8

Number of Output Enables per Element

1

Bus Hold

Yes

Triggering Type

Positive-Edge

Maximum Propagation Delay Time @ Maximum CL (ns)

14(Typ)@1.2V|3.4(Typ)@3.3V

Absolute Propagation Delay Time (ns)

7.5

Process Technology

CMOS

Input Signal Type

Single-Ended

Maximum Low Level Output Current (mA)

24

Maximum High Level Output Current (mA)

-24

Minimum Operating Supply Voltage (V)

1.2

Typical Operating Supply Voltage (V)

1.8|2.5|3.3

Maximum Operating Supply Voltage (V)

3.6

Maximum Quiescent Current (mA)

0.0001(Typ)

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Mounting

Surface Mount

Package Height

1.05(Max)

Package Width

6.2(Max)

Package Length

12.6(Max)

PCB changed

48

Supplier Package

TSSOP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

48

Output Type

3-State

Polarity

Non-Inverting

Logic Function

D-Type Bus Interface