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MC33MR2001V2VK

Freescale Semiconductor, Inc. (NXP Semiconductors) MC33MR2001V2VK

Part No:

MC33MR2001V2VK

Datasheet:

-

Package:

-

AINNX NO:

32000269-MC33MR2001V2VK

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    Yes
  • PPAP
    Yes
  • Mounting
    Surface Mount
  • Package Height
    0.7(Max)
  • Package Width
    6
  • Package Length
    6
  • PCB changed
    89
  • Standard Package Name
    BGA
  • Supplier Package
    VFBGA
  • Lead Shape
    Ball
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Pin Count

    a count of all of the component leads (or pins)

    89
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