Freescale Semiconductor, Inc. (NXP Semiconductors) PESD5V0R1BSFYL

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.10.00.80

Automotive

No

PPAP

No

Direction Type

Bi-Directional

Number of Elements per Chip

1

Maximum Working Voltage (V)

5

Minimum Breakdown Voltage (V)

6

Maximum Clamping Voltage (V)

5

Maximum Peak Pulse Current (A)

4.5

Maximum Leakage Current (uA)

0.05

Test Current (mA)

1

Capacitance Value (pF)

0.15

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Fail Safe Protection

No

Mounting

Surface Mount

Package Height

0.29(Max)

Package Width

0.33(Max)

Package Length

0.63(Max)

PCB changed

2

Standard Package Name

DSN

Supplier Package

DSN

Lead Shape

No Lead

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

TVS

Pin Count

a count of all of the component leads (or pins)

2

Configuration

Single