FTDI DLP-RFID1-OG

Package / Case

Module

Supplier Device Package

-

Package

Bulk

Base Product Number

DLP-RFID

Mfr

FTDI, Future Technology Devices International Ltd

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

1

Manufacturer

FTDI

Brand

FTDI

RoHS

Details

Series

DLP-RFID1

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Type

Read/Write

Subcategory

Development Tools

Frequency

13.56MHz

Interface

USB

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

NFC/RFID Development Tools

Standards

ISO 15693, ISO 18000-3

Product Category

a particular group of related products.

NFC/RFID Development Tools