FTDI, Future Technology Devices International Ltd UMFT4222EV-B

Package / Case

24-DIP Module

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2014

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Voltage - Supply

1.8V 2.5V 3.3V

Function

Bridge, USB to I2C/SPI

Interface

I2C, SPI

Protocol

USB

Standards

USB 2.0

Features

I2C

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant