Fujitsu MAW3147NC-RF

Lead Free Status / RoHS Status

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Contact Materials

Phosphor Bronze

Series

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Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

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Termination

Through Hole

Pitch

0.100 (2.54mm)

Contact Finish

Tin

Features

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Clip Style

SIL

Frame Width

0.713 (18.10mm)

Pin Length

0.374 (9.50mm)

Clip Length

0.055 (1.40mm)

Clip Type

Y1

Board Thickness

0.025 (0.64mm)

Frame Thickness

0.010 (0.25mm)