FUJITSU Semiconductor Limited FLK027WG

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

2

Transistor Element Material

GALLIUM ARSENIDE

Exterior Housing Material

1

Part Life Cycle Code

Transferred

Ihs Manufacturer

FUJITSU SEMICONDUCTOR AMERICA INC

Package Description

FLANGE MOUNT, R-CDFM-F2

Manufacturer Package Code

CASE WG

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Gross Weight

62.40

(Select First, Then Apply Filters) Compatible Series

har-switch, 22.3mm

Series

har-switch

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

ECCN Code

EAR99

Connector Type

DIN 5 pin - Din 5 pin, metal color - silver

Type

Momentary

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH RELIABILITY

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

4

JESD-30 Code

R-CDFM-F2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Actuator Type

Selector

Panel Cutout Dimensions

22.3mm (Round)

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

DEPLETION MODE

Illumination

Non-Illuminated

Case Connection

SOURCE

Polarity/Channel Type

N-CHANNEL

DS Breakdown Voltage-Min

15 V

FET Technology

JUNCTION

Requires

Contact Block(s)

Highest Frequency Band

KU BAND

Length

1500 mm