Glenair G77015

Material

Aluminum

Shape

Square, Fins

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Material Finish

Blue Anodized

Factory Pack QuantityFactory Pack Quantity

1

Manufacturer

Glenair

Brand

Glenair

RoHS

N

Series

pushPIN™

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Top Mount

Subcategory

Tools

Attachment Method

Push Pin

Height Off Base (Height of Fin)

0.236 (6.00mm)

Thermal Resistance @ Forced Air Flow

10.49°C/W @ 100 LFM

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Pliers & Tweezers

Thermal Resistance @ Natural

--

Power Dissipation @ Temperature Rise

--

Product Category

a particular group of related products.

Pliers & Tweezers

Width

2.756 (70.00mm)

Length

2.756 (70.00mm)

Diameter

--