A1475

Hakko A1475

Part No:

A1475

Manufacturer:

Hakko

Datasheet:

-

Package:

256-TFBGA

AINNX NO:

39976375-A1475

Description:

NOZZLE BGA 28X28X15MM

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    256-TFBGA
  • Supplier Device Package
    256-MBGA (11x11)
  • Number of I/Os
    160
  • Number of Macrocells
    440
  • Package
    Bulk
  • Mfr
    American Hakko Products, Inc.
  • Product Status
    Active
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 85°C (TJ)
  • Series
    MAX® II
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Base Part Number
    EPM570
  • Programmable Type

    These include Field Programmable Logic Devices (FPGAs), Complex Programmable Logic Devices (CPLD) and Programmable Logic Devices (PLD, PLA, PAL, GAL). There are also devices that are the analog equivalent of these called field programmable analog arrays.

    In System Programmable
  • Voltage Supply - Internal
    2.5V, 3.3V
  • Delay Time tpd(1) Max
    5.4ns
  • Number of Logic Elements/Blocks
    570
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