Hammond Manufacturing BPE2G

Factory Lead Time

12 Weeks

Mount

Wall

Weight

793.786647g

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

BPE2x

Published

2008

Size / Dimension

2.13Lx2.80W x 3.58 H 54.1mmx71.1mmx91.0mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

ECCN Code

EAR99

Connector Type

Screw

Color

Black

Applications

ITE (Commercial)

Power Rating

40W

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

40W

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

1.67A

Frequency

60Hz

Number of Outputs

1

Approval Agency

CSA, UL

Max Output Current

The maximum current that can be supplied to the load.

1.67A

Input Type

Fixed Blade

Voltage - Output

24VAC

Form

Wall Mount

Region Utilized

North America

Input Connector

NEMA 5-15P

Output Connector

Output (I/O) Connectors are for attaching external devices, such as printers, keyboards, and displays, to the server.

Screw Terminal

Height

90.932mm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant