Harwin Inc. M1352-98

Mount

Horizontal, Through Hole

Mounting Type

Through Hole, Horizontal

Material

Nylon, Polyamide

Housing Material

Nylon

Material - Insulation

Polyamide (PA66), Nylon 6/6

Material - Body

Phosphor Bronze

Contact Materials

Copper

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2002

Size / Dimension

0.453Lx0.156W 11.51mmx3.96mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

ECCN Code

EAR99

Connector Type

Plug

Type

PC Test Point Jack

Color

Black

Gender

Female

Orientation

Straight

Depth

3.96mm

Number of Contacts

2

Max Current Rating

5A

Plating

Gold

Number of Ports

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

1

Height

0.203 5.16mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant