HellermannTyton MDUS3-X2SP

Package / Case

QFN

Material

Acrylonitrile Butadiene Styrene (ABS)

Product Depth (mm)

2.5(mm)

Operating Temp Range

-20C to 70C

Mounting Styles

Surface Mount

Manufacturer Part Number

MDUS3-X2SP

Manufacturer

HellermannTyton

RoHS

Yes

Usage Level

Commercial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Type

MDU-S3-BXN

Color

Gray

Pin Count

a count of all of the component leads (or pins)

4

Number of Ports

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

7

Screening Level

Commercial

Product Length (mm)

3.2(mm)

Product Height (mm)

0.75(mm)