HEYCO PRODUCTS 13060

Mounting Type

Surface Mount

Package / Case

256-BBGA

Supplier Device Package

256-BGA (17x17)

Material

Nylon

Alternate PN

CCSA 3/4

Maximum Bundle Diameter

4.7 mm

Series

--

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Multi-Queue Flow-Control

Applications

--

Base Part Number

IDT72P517*9

Thread Size

given in nominal sizes, not in the actual measurement.

10 in

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Cable Mounts

Product

Cable Clamps

Width

12.7 mm

Height

19.1 mm