HEYCO PRODUCTS 13430B

Package / Case

1517-BBGA, FCBGA

Supplier Device Package

1517-FCBGA (40x40)

Material

Polyamide (PA)

Number of I/Os

588

Harmonized Code

ECCN

EAR99

Itar Registered

Unavailable

Factory Pack QuantityFactory Pack Quantity

1000

Mounting Hole Size

6.5 mm

Manufacturer

Heyco

Brand

Heyco

RoHS

Details

Package

Box

Mfr

Heyco Products Corporation

Product Status

Active

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 100°C (TJ)

Series

Arria 10 SX

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued at Digi-Key

Type

Nytye Fixed Rivet

Color

Black

Subcategory

Hardware

Speed

1.5GHz

RAM Size

256KB

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Screws & Fasteners

Hole Diameter

0.256 (6.50mm)

Primary Attributes

FPGA - 570K Logic Elements

Head Diameter

-

Flash Size

--

Rivet Length

6.650 (168.91mm)

Grip Range

0.040 ~ 0.080 (1.02mm ~ 2.03mm)

Product

Rivets

Rivet Diameter

-

Features

-

Product Category

a particular group of related products.

Screws & Fasteners

Length

169 mm

Head Height

-