HEYCO PRODUCTS 9162

Material

Aluminum

Shape

Square, Fins

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Material Finish

Blue Anodized

Head Diameter (mm)

6

Mounting Hole Diameter mm

3.1

Alternate PN

PRH 122-157

RoHS

Non-Compliant

Unit Weight

0.070548 oz

Factory Pack QuantityFactory Pack Quantity

5000

Mounting Hole Size

3.1 mm

Manufacturer

Heyco

Brand

Heyco

Tradename

HEYClip

Series

pushPIN™

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Top Mount

Color

Black

Subcategory

Hardware

Attachment Method

Push Pin

Height Off Base (Height of Fin)

0.236 (6.00mm)

Thermal Resistance @ Forced Air Flow

12.98°C/W @ 100 LFM

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Screws & Fasteners

Outside Diameter

The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.

6 mm

Thermal Resistance @ Natural

--

Power Dissipation @ Temperature Rise

--

Product

Rivets

Product Category

a particular group of related products.

Screws & Fasteners

Width

2.362 (60.00mm)

Length

2.362 (60.00mm)

Diameter

--