ZE05/RE-MD

Hirose ZE05/RE-MD

Part No:

ZE05/RE-MD

Manufacturer:

Hirose

Datasheet:

-

Package:

-

AINNX NO:

31009082-ZE05/RE-MD

Description:

Extraction, Removal & Insertion Tools Contact removal tool

Products specifications
  • RoHS
    Details
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Part # Aliases
    9025145000
  • Package
    Bulk
  • Mfr
    Hirose Electric Co Ltd
  • Product Status
    Active
  • For Use With/Related Products
    Rectangular Contacts, 20-22 AWG
  • Description/Function
    For Rectangular Contacts
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Series
    ZE05
  • Type
    Contact Removal Tool
  • Tool Type
    Extraction Tool
  • Product
    Removal Tools
  • Height
    1.5 mm
  • Length
    30 mm
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