IM73D122V01XTMA1

Infineon IM73D122V01XTMA1

Part No:

IM73D122V01XTMA1

Manufacturer:

Infineon

Datasheet:

Package:

-

AINNX NO:

42033887-IM73D122V01XTMA1

Category:

Microphones

Description:

MIC MEMS DIGITAL PDM OMNI -26DB

Products specifications
  • Shape
    Rectangular
  • Supporting protocol for MODBUS
    No
  • Number of HW-interfaces RS-232
    0
  • Number of HW-interfaces RS-422
    0
  • Appendant operation agent (Ex ia)
    No
  • Supporting protocol for Foundation Fieldbus
    No
  • Supporting protocol for SUCONET
    No
  • Supporting protocol for AS-Interface Safety at Work
    No
  • Supporting protocol for TCP/IP
    No
  • Voltage type of supply voltage
    DC
  • Explosion safety category for dust
    None
  • Radio standard Bluetooth
    No
  • IO link master
    No
  • Radio standard GPRS
    No
  • Supporting protocol for PROFIBUS
    No
  • Appendant operation agent (Ex ib)
    No
  • Radio standard GSM
    No
  • Front built-in possible
    No
  • Rack-assembly possible
    No
  • Number of HW-interfaces RS-485
    0
  • Explosion safety category for gas
    None
  • Radio standard UMTS
    No
  • Supporting protocol for CAN
    No
  • Supporting protocol for SafetyBUS p
    No
  • Supporting protocol for KNX
    No
  • Suitable for safety functions
    No
  • Supporting protocol for PROFIsafe
    No
  • Number of HW-interfaces USB
    0
  • Number of HW-interfaces other
    1
  • Supporting protocol for PROFINET CBA
    No
  • Supporting protocol for DeviceNet Safety
    No
  • Rail mounting possible
    Yes
  • Wall mounting/direct mounting
    No
  • Number of HW-interfaces industrial Ethernet
    0
  • Supporting protocol for LON
    No
  • System accessory
    No
  • SIL according to IEC 61508
    None
  • Degree of protection (NEMA)
    Other
  • Supporting protocol for INTERBUS
    No
  • Degree of protection (IP)
    IP20
  • Supporting protocol for DeviceNet
    Yes
  • Radio standard Wi-Fi 802.11
    No
  • Supporting protocol for INTERBUS-Safety
    No
  • Number of HW-interfaces Wireless
    0
  • Number of HW-interfaces serial TTY
    0
  • Supporting protocol for SERCOS
    No
  • Supporting protocol for Data-Highway
    No
  • Supporting protocol for EtherNet/IP
    No
  • Number of interfaces PROFINET
    0
  • Supporting protocol for ASI
    No
  • Fieldbus connection over separate bus coupler possible
    No
  • Supply voltage DC
    20.4 - 26.4
  • Type of electric connection
    Screw connection
  • Supporting protocol for other bus systems
    No
  • Number of HW-interfaces parallel
    0
  • Supporting protocol for PROFINET IO
    No
  • Package
    Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
  • Mfr
    Infineon Technologies
  • Product Status
    Active
  • Voltage Rated

    RATED voltage is the voltage on the nameplate - the "design point" for maximum power throughput and safe thermal operation.

    1.8 V
  • Factory Pack QuantityFactory Pack Quantity
    5000
  • Manufacturer
    Infineon
  • Brand
    Infineon Technologies
  • RoHS
    Details
  • Series
    XENSIV™
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Size / Dimension
    0.157 L x 0.118 W (4.00mm x 3.00mm)
  • Termination
    Solder Pads
  • Type
    MEMS (Silicon)
  • Depth
    50
  • Output Type
    Digital, PDM
  • Current - Supply
    1.12 mA
  • Direction
    Omnidirectional
  • Voltage Range
    1.62 V ~ 3.6 V
  • Frequency Range

    A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

    20 Hz ~ 19 kHz
  • Sensitivity
    -26dB ±1dB @ 94dB SPL
  • Port Location
    Top
  • S/N Ratio
    73dB
  • Product Category

    a particular group of related products.

    Infineon
  • Height
    50
  • Width
    115
  • Height (Max)
    0.051 (1.30mm)
  • Ratings
    IP57 - Dust Protected, Waterproof
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