BGA616H6327XTSA1

Infineon Technologies BGA616H6327XTSA1

Part No:

BGA616H6327XTSA1

Datasheet:

BGA616

Package:

SC-82A, SOT-343

ROHS:

AINNX NO:

734468-BGA616H6327XTSA1

Category:

RF Amplifiers

Description:

RF Amp Chip Single GP 6GHz 4.5V 4-Pin(3+Tab) SOT-343 T/R

Products specifications
  • Factory Lead Time
    6 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    SC-82A, SOT-343
  • Number of Pins
    4
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2005
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    150°C
  • Min Operating Temperature
    -65°C
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    360mW
  • Construction
    COMPONENT
  • Frequency
    0Hz~2.7GHz
  • Number of Channels
    1
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    4.5V
  • Test Frequency

    a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

    1GHz
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    360mW
  • Halogen Free
    Halogen Free
  • Gain
    19dB
  • RF/Microwave Device Type
    WIDE BAND LOW POWER
  • RF Type

    The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

    CDMA, GSM, PCS
  • Characteristic Impedance
    50Ohm
  • Noise Figure

    Noise figure (NF) and noise factor (F) are measures of degradation of the signal-to-noise ratio (SNR), caused by components in a signal chain.

    2.5dB
  • P1dB
    18dBm
  • Height
    900μm
  • Length
    2mm
  • Width
    1.25mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
0 Similar Products Remaining
Documents & Media Download datasheets and manufacturer documentation for Infineon Technologies BGA616H6327XTSA1.