Infineon Technologies IRF7341TRPBF

Factory Lead Time

12 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

8-SOIC (0.154, 3.90mm Width)

Number of Pins

8

Transistor Element Material

SILICON

Number of Elements

2

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

32 ns

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

HEXFET®

Published

2004

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

8

ECCN Code

EAR99

Resistance

50mOhm

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

AVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCE

Voltage - Rated DC

55V

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

2W

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

4.7A

Time@Peak Reflow Temperature-Max (s)

30

Base Part Number

IRF7341PBF

Row Spacing

the space needed between rows to allow room for people or farm equipment to get through.

6.3 mm

Number of Channels

2

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Dual

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

2W

Turn On Delay Time

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

8.3 ns

FET Type

2 N-Channel (Dual)

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

50m Ω @ 4.7A, 10V

Vgs(th) (Max) @ Id

1V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

740pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

36nC @ 10V

Rise Time

In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

3.2ns

Fall Time (Typ)

13 ns

Continuous Drain Current (ID)

4.7A

Threshold Voltage

1V

Gate to Source Voltage (Vgs)

20V

Drain Current-Max (Abs) (ID)

5.1A

Drain to Source Breakdown Voltage

55V

Dual Supply Voltage

55V

Avalanche Energy Rating (Eas)

140 mJ

FET Technology

METAL-OXIDE SEMICONDUCTOR

Recovery Time

90 ns

Max Junction Temperature (Tj)

150°C

FET Feature

Logic Level Gate

Nominal Vgs

1 V

Height

1.75mm

Length

4.9784mm

Width

3.9878mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Contains Lead, Lead Free