709349L9BF

Integrated Device Technology (IDT) 709349L9BF

Part No:

709349L9BF

Datasheet:

-

Package:

-

AINNX NO:

29379856-709349L9BF

Category:

Memory

Description:

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    100
  • Package Description
    FPBGA-100
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH
  • Moisture Sensitivity Levels
    3
  • Number of Words Code
    4000
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA100,10X10,32
  • Manufacturer Package Code
    BF100
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Access Time-Max
    20 ns
  • Operating Temperature-Max
    70 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    709349L9BF
  • Number of Words
    4096 words
  • Supply Voltage-Nom (Vsup)
    5 V
  • Package Code
    LFBGA
  • Package Shape
    SQUARE
  • Manufacturer
    Integrated Device Technology Inc
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    INTEGRATED DEVICE TECHNOLOGY INC
  • Risk Rank
    5.91
  • Part Package Code
    CABGA
  • JESD-609 Code
    e0
  • Pbfree Code
    No
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    FLOW-THROUGH OR PIPELINED ARCHITECTURE
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.41
  • Subcategory
    SRAMs
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8 mm
  • Reach Compliance Code
    not_compliant
  • Pin Count

    a count of all of the component leads (or pins)

    100
  • JESD-30 Code
    S-PBGA-B100
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Brand Name
    Integrated Device Technology
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    2
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Supply Current-Max
    0.36 mA
  • Organization
    4KX18
  • Output Characteristics
    3-STATE
  • Seated Height-Max
    1.5 mm
  • Memory Width
    18
  • Standby Current-Max
    0.003 A
  • Memory Density
    73728 bit
  • Parallel/Serial
    PARALLEL
  • I/O Type
    COMMON
  • Memory IC Type
    DUAL-PORT SRAM
  • Standby Voltage-Min
    4.5 V
  • Width
    10 mm
  • Length
    10 mm
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