IDT74ALVCH16501PAG8
TFSOP
16419618-IDT74ALVCH16501PAG8
TXRX 18BIT UNIV BUS 3ST 56-TSSOP
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
The center distance from one pole to the next.
a count of all of the component leads (or pins)
An indicator of formal certification of qualifications.
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.
High-level Output Current IOH The current flowing into the output at a specified high- level voltage. Low-level Output Current IOL The current flowing into the output at a specified low- level output voltage.
The current into the output terminal with input conditions applied that, according to the product specification, will establish a low level at the output.
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.