Intel HIP6601BCB

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

8

Package Description

SOP,

Package Style

SMALL OUTLINE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

12 V

Reflow Temperature-Max (s)

NOT SPECIFIED

Supply Voltage-Min

10.8 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

HIP6601BCB

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

Active

Ihs Manufacturer

ROCHESTER ELECTRONICS INC

Supply Voltage-Max

13.2 V

Risk Rank

5.68

Part Package Code

SOIC

JESD-609 Code

e0

Pbfree Code

No

Terminal Finish

TIN LEAD

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

240

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1.27 mm

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

8

JESD-30 Code

R-PDSO-G8

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Seated Height-Max

1.75 mm

Interface IC Type

HALF BRIDGE BASED MOSFET DRIVER

Output Peak Current Limit-Nom

0.73 A

High Side Driver

YES

Supply Voltage1-Min

5 V

Supply Voltage1-Max

12 V

Width

3.9 mm

Length

4.9 mm