Inventek Systems LTE-P12013-U

Factory Pack QuantityFactory Pack Quantity

100

Mounting Styles

Clip

Manufacturer

Advanced Thermal Solutions

Heatsink Material

Aluminum

Brand

Advanced Thermal Solutions

Tradename

maxiFLOW superGRIP

RoHS

Details

Designed for

BGA

Fin Style

Angled Fin

Series

maxiFLOW superGRIP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Color

Black

Subcategory

Heatsinks

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Heatsinks

Product

Heatsink Assemblies

Product Category

a particular group of related products.

Heat Sinks

Thermal Resistance

Thermal resistance is defined as the ratio of the temperature difference between the two faces of a material to the rate of heat flow per unit area. Thermal resistance determines the heat insulation property of a textile material. The higher the thermal resistance, the lower is the heat loss.

2.7 C/W

Width

36.75 mm

Height

14.5 mm

Length

36.75 mm