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Isocom Components ISP817C
Part No:
ISP817C
Manufacturer:
Datasheet:
Package:
DIP-4
ROHS:
AINNX NO:
20836833-ISP817C
Description:
Products specifications
- Package / CaseDIP-4
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tube-packed - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
RoHS Compliant
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