ITT Cannon, LLC 120220-0311

Factory Lead Time

22 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Mount

Surface Mount

Material

Titanium Copper

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Connector Type

Non-Gendered

Type

Shield Finger, Pre-Loaded

Number of Rows

1

Number of Contacts

1

Plating

Nickel

Attachment Method

Solder

Height

0.071 1.80mm

Length

0.098 2.50mm

Width

0.038 0.96mm

Plating Thickness

118.11μin 3.00μm