ITT Cannon, LLC 204-0016-000

Factory Lead Time

12 Weeks

Material

GLASS FILLED THERMOPLASTIC

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

DL

Published

1999

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Reach Compliance Code

compliant

Connector Support Type

CONNECTOR ACCESSORY

Accessory Type

Handle

Specifications

a measure of a material's ability to?conduct heat.?

DL1, DL2, DL3, DLM1, DLM2, DLM3