JAE Electronics FF0221SS1R3000

Mounting Type

BOARD

Mounting Option 1

LOCKING MECH

RoHS

Details

Factory Pack QuantityFactory Pack Quantity

3000

Package Description

LEAD FREE

Contact Finish Mating

NOT SPECIFIED

Body Length

0.354 inch

Insulator Material

LIQUID CRYSTAL POLYMER (LCP)

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

FF0221SS1-R3000

Mounting Styles

RIGHT ANGLE

Number of Rows Loaded

1

Contact Materials

NOT SPECIFIED

Part Life Cycle Code

Obsolete

Ihs Manufacturer

JAPAN AVIATION ELECTRONICS INDUSTRY LTD

Risk Rank

5.84

Series

FF

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Connector Type

FFC/FPC CONNECTOR

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

LOW PROFILE

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Filter Feature

NO

Mixed Contacts

NO

Option

GENERAL PURPOSE

Total Number of Contacts

21

Terminal Pitch

The center distance from one pole to the next.

0.3 mm

Reach Compliance Code

unknown

Reference Standard

UL

Reliability

COMMERCIAL

Number Of PCB Rows

2

PCB Contact Pattern

STAGGERED

Body Breadth

0.047 inch

Contact Gender

FEMALE

UL Flammability Code

94V-0

Body Depth

0.15 inch

Rated Current (Signal)

0.4 A

Contact Style

BELLOWED TYPE

Contact Resistance

40 mΩ

Insulation Resistance

The measurement of insulation resistance is carried out by means of a megohmmeter – high resistance range ohmmeter. A general rule-of-thumb is 10 Megohm or more.

100000000 Ω

Mating Contact Pitch

0.024 inch

Termination Type

SURFACE MOUNT

Dielectric Withstanding Voltage

250VAC V

PCB Contact Row Spacing

3.175 mm

Contact Pattern

STAGGERED

Insulator Color

WHITE

Product

Board Mount

Plating Thickness

4u inch