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Jameco BenchPro 24-7068-7601-JVP
Part No:
24-7068-7601-JVP
Manufacturer:
Datasheet:
Package:
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AINNX NO:
70164012-24-7068-7601-JVP
Category:
Description:
0.031" Diameter 96.5% Tin 3% Silver 0.5% Copper Solder with Flux No Clean Roll
Products specifications
- Weight500 g
- Tin Composition96.5%
- Lead CompositionN/A
- Silver Composition3%
- Copper Composition0.5%
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Roll - Diameter0.031 in. (0.79 mm)
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