JS27HU2G08SDDA-25-SU
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69479229-JS27HU2G08SDDA-25-SU
2G SLC NAND PKG 9x11mm 63FBGA 25
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
CAT24FC32JI
Catalyst SemiconductorDescription: EEPROM, 4KX8, Serial, CMOS, PDSO8, SOIC-8P4C198A-30CMB
Pyramid Semiconductor CorporationStandard SRAM, 16KX4, 30ns, CMOS, CDIP24CAT64LC10SI-TE13
Catalyst SemiconductorDescription: EEPROM, 64X16, Serial, CMOS, PDSO8, SOIC-8M53D256328A-5BG2F
Elite Semiconductor Memory Technology IncDescription: DDR DRAM, 8MX32, 5ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MO-205, FBGA-144CAT25C02LI
Catalyst SemiconductorDescription: EEPROM, 256X8, Serial, CMOS, PDIP8, 0.300 INCH, GREEN, PLASTIC, MS-001, DIP-8MU9C2480L-90DC
Music Semiconductors IncDescription: Content Addressable SRAM, 2KX64, 75ns, CMOS, PQCC44CAT25128LI
Catalyst SemiconductorDescription: EEPROM, 16KX8, Serial, CMOS, PDIP8, 0.300 INCH, GREEN, MS-001, PLASTIC, DIP-8CAT93C66WI-1.8-GT3
Catalyst SemiconductorDescription: EEPROM,M53D2561616A-5BG2F
Elite Semiconductor Memory Technology IncDescription: DDR DRAM, 16MX16, 5ns, CMOS, PBGA60, 8 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, BGA-60CAT24C05WI
Catalyst SemiconductorEEPROM,