Kaga FEI America, Inc. MB95F168JAPMC1-GE1

Mounting Type

Surface Mount

Package / Case

64-LQFP

Supplier Device Package

64-LQFP (12x12)

Mfr

Kaga FEI America, Inc.

Programmable

Not Verified

Number of I/Os

52

Data Converters

A/D 8x8/10b

Base Product Number

MB95F168

Series

F2MC MB95160MA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 85°C (TA)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

External

Speed

16MHz

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

2.4V ~ 5.5V

Core Processor

F2MC-8FX

Peripherals

LCD, LVD, POR, PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

8-Bit

Program Memory Size

60KB (60K x 8)

Connectivity

I2C, LINbus, SIO, UART/USART