Kester 301004

Part No:

301004

Manufacturer:

Kester

Datasheet:

Package:

QFN

AINNX NO:

36800718-301004

Category:

Soldering, Desoldering, Rework Tips, Nozzles

Description:

TSF-6522RH 100G JAR

Products specifications

Package / Case
QFN
Product Depth (mm)
2.5(mm)
Operating Temp Range
-20C to 70C
Mounting Styles
Surface Mount
Usage Level
Commercial grade
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Bulk
Pin Count
a count of all of the component leads (or pins)
4
Screening Level
Commercial
Product Length (mm)
2(mm)
Product Height (mm)
0.75(mm)

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