Kester Solder 24-6040-0018

Factory Lead Time

5 Weeks

Weight

1lb 453.59g

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Spool

Series

44

Published

2005

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Type

Wire Solder

Composition

Sn60Pb40 (60/40)

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

22 AWG, 23 SWG

Wire/Cable Gauge

22 AWG

Storage/Refrigeration Temperature

50°F~104°F 10°C~40°C

Form

Spool, 1 lb (454 g)

Outside Diameter

The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.

635 μm

Process

Leaded

Melting Point

361°F~374°F 183°C~190°C

Flux Type

Rosin Activated (RA)

Diameter

0.025 0.64mm

Height

57.15mm

Length

74.93mm

Width

76.2mm

REACH SVHC

Unknown

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant

Lead Free

Contains Lead