SU60-2230C-PU

Laird Connectivity SU60-2230C-PU

Part No:

SU60-2230C-PU

Manufacturer:

Laird Connectivity

Datasheet:

-

Package:

-

AINNX NO:

31254502-SU60-2230C-PU

Description:

Sub-GHz Modules 60 Series, Summit Module w/u.FL, PCIE/USB

Products specifications
  • RoHS
    Details
  • Factory Pack QuantityFactory Pack Quantity
    100
  • Unit Weight
    0.098767 oz
  • Package
    Tray
  • Mfr
    Laird Connectivity Inc.
  • Product Status
    Active
  • Protocol - WiFi - 802.11
    802.11 a/b/g/n/ac
  • Protocol - Sub GHz
    -
  • Series
    60
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
0 Similar Products Remaining